Featured Inventory

Your Source for the Microscopy Equipment and Electron Microscopes You Need

At J. Kraft Microscopy, we are focused on providing our customers with the best new and reconditioned equipment available. Thanks to our extensive network of industry partners and vast inventory across a variety of brands, we can best match the right products to your application.

To Meet our customers unique needs, our product offerings go beyond our standard inventory. We will work with you to configure custom systems, instrumentation, and parts to give you exactly what you need.

If you have question or are uncertain about what product will meet you needs best, you can request more information through our microscopy products information form. We are here to help provide you with the information you need, to make the best purchasing decision.

Previous Next

SEM Topography

Description
Applications
Technical
Images

Contact Team To Learn More

Hardware

Turnkey add-on system for any SEM

Backscattered electron detector
Multi-channel video processor
Scan generator and image acquisition
Live surface topography software

Multi-segment solid-stage backscattered electron detectors

Monolithic or hybrid quadrant sensors for high resolution
Optional light blind sensors for high temperature/in situ SEM
In situ pre-amplification for minimum noise and maximum speed

Video processor for simultaneous data acquisition

Channel independent brightness and contrast controls
Hardware mixed output for simultaneous acquisition with SE, BSE, EBIC, CL, or EDS
USB controlled and fully integrated with the acquisition software

The most powerful and versatile SEM scanning system – DISS5

Integrated scan generator and image acquisition
Very large image resolution, up to 16k x 16k pixels
Very fast scanning speed, down to 200ns dwell time
Simultaneous 4x analogue and 12x digital counter inputs

Software

Completely integrated control and acquisition

Live surface height reconstruction from BSE signals
Built-in 3D surface visualisation tool
Configurable workflows with integrated SE and BSE scan profiles

Reconstructed height is purely topographic and quantitative

Surface normals are calculated from 4x BSE gradients at each beam position
Complete surface topography is assembled from all surface normals
Height resolution depends primarily on beam/sample interaction volume

Live height visualisation tool

Pan, rotate, tilt, zoom and scale Z
Enhance with shadows and custom colour coding
Export to standard binary AL3D and plain text SDF formats

One step calibration software with dedicated SEM standard – m2c

Calibration of scale in all three spatial directions
Orthogonality of all axes (shearing)
Analysis of nonlinear deviations

Measure surface topography with SEM

Use conventional segmented BSE signals
Get immediate feedback with automated topographic reconstruction
Save topographic data in standard surface file formats

Distinguish between sample composition and surface topography

Resolve ambiguities in image interpretation
Reach a wider audience with 3D models, visualisation and printing
Measure 3D distances, volumes, steps, roughness, texture…

Monitor FIB milling and GIS deposition

Improve yield of TEM and atom probe sample preparation
Verify thickness of GIS deposited layers
Monitor FIB milling depths and roughness

Visualise complex surfaces with ease

Add texture from SE, EDS or EBSD maps
Manipulate automatic colour textures
Extract 3D screenshots for high-impact visualisation

Calibrate and measure height from offline BSE data

Calibrate measurements with dedicated calibration sample
Measure 3D positions, distances and angles
Measure height and texture for visualisation and analysis

Continue live topography workflow with off-line analysis

Import data into full feature analysis software
Measure surface roughness and analyse texture
Analyse morphology, grain and particle distributions

Backscattered (BSE) detector

Sensor geometry: 4x quadrant diodes (monolithic sensor), or 4x rectangular diodes (hybrid sensor)
Sensor min. energy: 1keV for detector grade Si diodes, or 5keV for standard Si diodes
Sensor mount: retractable arm, or pole piece mount
Sensor height: 1.2 mm
Pre-amplifier mount: in situ
Pre-amplifier gain: 10^7 V/A fixed
Pre-amplifier size: 22 x 18 mm

Video processor module

Hardware interface: USB 2.0
BSE signal inputs: 4x max.
SE and AUX signal inputs: 3x max.
Simmultaneous output signals: 4x max.
Mixed BSE output: 1x conventional compo.
Gain: 1 … 100x
Output offset: 1.25V max
Brightness and Contrast control: integrated software control
Signal inversion: Yes
Low-pass filter: 8-levels

Topography calibration sample (m2c)

GIS deposited calibration structures: 3x multi-level pyramidal, 1x spherical element
FIB milled recognition structure: nanomarkers
Total area: 80 x 80 μm, or 40 x 40 μm
Nanomarker geometry: 800 nm, or 600 nm
Pyramidal element geometry: 90 x 90 x 3 µm, or 45 x 45 x 1.8 µm
Spherical element geometry: 10 x 10 x 1 µm
Reference data: CD/ROM

SEM topography acquisition module (DISS 5 Topography)

Hardware interface: USB 2.0
Simultaneous inputs (i.e. SE, BSE): 4x, 12-bit
Mapping signals (i.e. EDS): 12x, 12-bit
Scanning interface: pre-configured for SEM and analytical add-ons
Synchronization interface: pixel, line, frame
Scan size: 16,384 x 16,384 pixels max.
Pixel dwell time: 200 ns … 6 milliseconds
Pixel over-sampling: 32,000x max.
Line averaging: 50x max.
Frame averaging: 256x max.
Synchronization: mains power
ROI scan: yes

PC/Laptop, Display

PC/Laptop: Intel Core i3, 2x USB 2.0 minimum
Display: 1,280 x 1,024 resolution minimum, 2x displays recommended
Operating systems: Windows 10 … Windows XP
Network connection: recommended

Acquisition software (DISS 5 Topography)

BSE detector control: complete software integration
SEM mag, kV information: automated SEM communication
SEM topography reconstruction: live automatic shape-from-shade (m2c)
SEM topography display: 3D visualisation, mountain view
SEM topography control: live rotation, pan, tilt, zoom, height-rescalling
SEM topography texture: solid colour, height-coded colour LUT
Image mixing tool: independent colour/channel, independent intensity/channel, topographic and compositional profiles
Scan profile templates: live display, region of interest (ROI), slow scan, area mapping, line scan, video recording (AVI)
Signal monitor: analogue signals profiles, level meter graphs, gradation graph tool
Software API: yes
Image caption overlay: yes
Default BSE image file formats: 8 and 16-bit multi-page TIFF
Default topography file formats: AL3D, SDF
Export image file formats: BMP, JPEG, PNG, GIF
Export topography file formats: BMP
Operating system: Windows 10 … Windows XP
Context sensitive help: English, German

Analysis software (microCal and micro-Shape from m2c)

XYZ calibration: one step calibration with dedicated calibration structure
Data extraction: point and line profiles
3D measurements: distances, angles
Save file formats: BCR, BCRF, AL3D, NMM, ASC
Export file formats: PLY, TIF, BMP, JPG, PNG, GIF, TXT, DAT
Operating system: Windows 10 … Windows XP
Context sensitive help: English, German

Parts and Cables

BSE sensor: optional 1x
BSE pre-amplifier: optional 1x
BSE insertion/retraction mechanism: optional 1x
BSE in situ cable: optional 1x
BSE vacuum electrical feedthrough: optional 1x
BSE ex situ cable: standard 1x
Topography calibration sample: standard 1x
Video processor module: standard 1x
Video processor ground strap: standard 1x
SEM mixed control & acquisition cable: standard 1x
SEM acquisition module: standard 1x
USB cables: standard 2x
USB memory stick: standard 1x
PC, keyboard, mouse: optional 1x
Displays: optional 2x

Software packages

Video Processor USB driver: Video Processor
SEM acquisition USB driver: Digital Image Scanning System 5
Shape-from-shadow library: m2cMicroShape (m2c)
Acquisition software: DISS 5
Analysis software: microShape (m2c)
Calibration software: microCal (m2c)

Weight and Dimensions

Video processor dimensions: 19 x 10.5 x 5 cm
Video processor weight: 1.1 kg
DISS5 module dimensions: 23.5 x 8.7 x 29.5 cm
DISS5 module weight: 3.4 kg
Shipping dimensions: typ. 36 x 32 x 56 cm
Shipping weight: typ. 7.5 kg

Site requirements

Power: 2x mains 110/220 VAC single phase 50-60 Hz, on the same earth as the microscope
SEM chamber: 1x flange prepared for muti-pin vacuum electrical feedtrough to pre-amplifier
SEM earth: 1x ground strap
SEM interface: 1x external analogue interface for XY scan control and SEM signals
Space: video processor module must be placed in close proximity of the SEM chamber, power supply and DISS5 modules may be placed on the SEM bench

EBAC Aquisition System

Description
Applications
Technical
Images

Contact Team To Learn More

Hardware

The system is fully integrated and software controlled

Image acquisition and amplification control are integrated
All amplification and acquisition parameters are software controlled
Acquisition system is compatible with all nanoprobers and SEM, including FIB/SEMs

Lowest noise EBAC/RCI amplification with in situ pre-amplifier

In situ preamplification is optimised and fixed at 10^7 V/A
Second stage amplification optimizes signal for image acquisition
Signal is digitized at 12.bit to minimise quantification noise

The most powerful and versatile SEM scanning system – DISS5

Integrated scan generator and image acquisition
Very large image resolution, up to 16k x 16k pixels
Very fast scanning speed, down to 200ns dwell time
Simultaneous 4x analogue and 12x digital counter inputs

Software

The system is software controlled for efficiency and ease-of-use

Image scanning and amplifier control are integrated into one app
All amplification and acquisition parameters are accessible to end user
Signal is automatically quantified and displayed in current units (µA, nA, pA)

Simultaneous signals are mixed live for localisation

Up to 4x simultaneous signals
12-bit digitization with signal integration (oversampling)
Live colour mixing tool for visualisation

Current-voltage (IV) tool is integrated for assisted touchdown

Voltage output maximum range is -10…+10 V
Gain selection for current measurements is automatic
IV data may be exported in standard formats

Configurable scan profiles enable custom workflows for efficient use

Fast EBAC scan profile for alignment and navigation
Simultaneous SE/EBAC scan profile for localization
High resolution EBAC scan profile for mapping and analysis

Live signal monitor assists image acquisition and calibration

Live line scan signals are displayed for optimisation
Multiple live signals are displayed simultaneously
The gradation graph improves display of complex shadows

Advanced modes include biasing, beam current and calibration

Bias is DC and includes current compensation
Voltage bias is also included for voltage contrast
All amplifier settings can be saved and reloaded

Characterize interconnects with the highest resolution

Reveal electrical integrity of nets with sub-micron resolution
Diagnose contamination, metal patterning defects, resistive interconnectors
Directly isolate defects to exact layer and die location

Find exact location of any open, resistive or shorting defect

Localize metal line cuts caused by cracking, corrosion, electro-migration or foreign particles
Identify resistive opens caused by interface contamination at vias
Pinpoint location for direct TEM lamella FIB preparation

Verify device operation models with built-in biasing for voltage contrast

Image bias/voltage contrast in delayered devices
Monitor operation of devices under bias
Compare imaged behaviour with device design

Localize defects in thin dielectric layers

Visualize weaknesses in GOX or COX before breakdown
Pinpoint oxide shorts caused by ESD or EOS with sub-micron resolution
Preserve the original defect with nW power dissipation during analysis

Access failures invisible in voltage contrast

Find low resistances that allow charge tunnelling through interconnects
Investigate structures in contact with the silicon substrate
Characterize large metal structures

EBAC/RCI pre-amplifier module

Gain: 10^7 V/A fixed
Mount: in situ, on the SEM sample stage
Board type: standard PCB

EBAC/RCI amplifier module

Hardware interface: USB2.0
Input offset/brightness: -1 … 1 µA, 16-bit
Signal gain/contrast: 0.1 … 100x, 16-bit
Signal inversion: yes
Bias voltage: -10 … 10 V, 16-bit
Current compensation: -10 … 10 µA, 16-bit
Low-pass filter: 8-levels
Zero-balanced/calibrated pre-amplifier: manual
Beam blank output: TTL

EBAC/RCI and SEM acquisition module (DISS5 EBAC/RCI)

Hardware interface: USB 2.0
Simultaneous inputs (i.e. SE, EBIC): 4x, 12-bit
Mapping signals (i.e. EDS): 12x, 12-bit
Scanning interface: pre-configured for SEM and analytical add-ons
Synchronization interface: pixel, line, frame
Scan size: 16,384 x 16,384 pixels max.
Pixel dwell time: 200 ns … 6 milliseconds
Pixel over-sampling: 32,000x max.
Line averaging: 50x max.
Frame averaging: 256x max.
Synchronization: mains power
ROI scan: yes

Electrical sample holder

Contacting probes: 2x
Contacting geometries: 1x top and 1x bottom, or 2x top
Imaging geometry: plan-view and cross-section
Faraday cage: 2x
Maximum sample size: typ. 25 x 50 mm
Holder height: 20 mm

PC/Laptop and Display

PC/Laptop: Intel Core i3, 1x USB 2.0 minimum
Display: 1,280 x 1,024 resolution minimum, 2x displays recommended
Operating systems: Windows 10 … Windows XP
Network connection: recommended

Acquisition software (DISS5 EBAC/RCI)

EBAC/RCI control: complete software integration
EBAC/RCI operation modes: standard, biased, calibration
EBAC/RCI configuration: complete profile save/load
EBAC/RCI inspector: quantified live current readings
Current voltage (IV) tool: configurable voltage range, number of points, settle time
SEM mag, kV information: automated SEM communication
Brightness & Contrast controls: manual/automatic, channel independent control
Image mixing tool: independent colour/channel, independent intensity/channel, topographic and compositional profiles
Scan profile templates: live display, region of interest (ROI), slow scan, area mapping, line scan, video recording (AVI)
Signal monitor: analogue signals profiles, level meter graphs, gradation graph tool
Software API: yes
Image caption overlay: yes
Default file formats: 8 and 16-bit multi-page TIFF
Export file formats: BMP, JPEG, PNG, GIF
Operating system: Windows 10 … Windows XP
Context sensitive help: English, German

Analysis software (DIPS5 EBAC/RCI)

Current quantification: automated data management
Magnification/scale information: automated scale management
Image caption overlay: configurable live and image export overlays
Image information display: all relevant acquisition parameters
Image mix (SE, EBIC, etc.): configurable colour assignment
Editable LUT (look up table): false colour, GGR file format
Pseudo-surface view: pan/zoom/rotation/tilt controls, emission/ambient/diffuse lighting, original texture/false colouring
Distance, area measurements: live display
Data extraction: multiple lines/points, simultaneous signal extraction, line/signal diagrams, optional smoothing, absolute/relative scaling
Operating system: Windows 10 … Windows XP
Context sensitive help: English, German